Leveling agent for nickel electrolytic plating and nickel electrolytic plating solution containing the leveling agent

摘要

An embodiment of the present invention provides a leveling agent for nickel electrolytic plating capable of forming a nickel plating film having uniform thickness by improving flatness of the nickel plating film when the nickel plating film is formed in an electrolytic plating method. Furthermore, a provided technique related to nickel plating solution comprises: electrolyte solution and the leveling agent for nickel electrolytic plating including nickel ion; and an organic additive having a polish and stress remover, thereby capable of forming the nickel plating film having the uniform thickness on a substrate having a complex surface curvature in an electrolytic plating method.