HIGH THERMALLY CONDUCTIVE LOW PRESSURE MOULDABLE HOTMELT

摘要

The present invention relates to a hot melt adhesive having improved thermal conductivity, and its use. The adhesive composition of the present invention comprises at least one (co) polymeric binder and at least one filler as defined herein. The thermally conductive hot melt adhesive composition according to the present invention also seeks to encapsulate a heating device such as a printed circuit board to provide better heat dissipation.