AN APPARATUS FOR COATING SURFACES USING ULTRASONIC WAVES AND A SYTSEM COMPRISING THE SAME

摘要

The present invention relates to an apparatus for coating a surface using ultrasonic wave and a system comprising the same. According to an embodiment of the present invention, the system for coating a surface using ultrasonic wave comprises: a loading part in which an electronic component with a lead frame is disposed on a process line and transported; a trim part for cutting the electronic component, which is disposed on the process line and transported from the loading part; a coating part having a solder unit including a molten solder, arranging and fixing the electronic component cut into individual components by the trim part on the solder unit, having an ultrasonic wave output unit for emitting ultrasonic waves to a surface of the lead frame provided with the electronic component, and having a dipping unit for dipping the electronic component provided with ultrasonic wave irradiated lead frame to the molten solder; and a discharge part for discharging the electronic component with the surface of the lead frame coated by the coating part.