首页> 外国专利> BORANE MEDIATED DEHYDROGENATION PROCESS FROM SILANE AND ALKYLSILANE SPECIES FOR SPACER AND HARDMASK APPLICATION

BORANE MEDIATED DEHYDROGENATION PROCESS FROM SILANE AND ALKYLSILANE SPECIES FOR SPACER AND HARDMASK APPLICATION

机译:硼烷介导的硅烷和烷基硅烷物种的加氢过程,用于间隔和硬烷基化应用

摘要

Implementations illustrated in the present application generally relate to manufacturing of an integrated circuit, and specifically to deposition of boron-doped amorphous silicon layers on a semiconductor substrate. In an implementation, provided is a forming method of a boron-doped amorphous silicon layer on a semiconductor substrate. The forming method comprises: a step of depositing a sacrifice dielectric layer of a predetermined thickness on a substrate; a step of forming patterned pitchers on the substrate by removing parts of the sacrifice dielectric layer to expose the top surface of the substrate; a step of isogonally depositing the boron-doped amorphous silicon layer of a predetermined thickness on the exposed top surface of the substrate and the patterned pitchers; and a step of selectively removing the boron-doped amorphous silicon layer from the top surface of the substrate and the top surface of the pattered pitchers by using an anisotropic etching process to provide the patterned pitchers charged in side wall spacers which are formed from the boron-doped amorphous silicon layer.
机译:本申请中示出的实施方式通常涉及集成电路的制造,并且具体地涉及在半导体衬底上沉积硼掺杂的非晶硅层。在一个实施方式中,提供了一种在半导体衬底上的掺硼非晶硅层的形成方法。形成方法包括:在基板上沉积预定厚度的牺牲介电层的步骤;通过去除牺牲介电层的一部分以暴露出衬底的顶表面而在衬底上形成图案化的水笼的步骤;在衬底的暴露的顶表面和图案化的水罐上等距沉积预定厚度的掺硼非晶硅层的步骤;通过各向异性蚀刻工艺从衬底的顶表面和图案化的水笼的顶表面选择性地去除掺硼的非晶硅层的步骤,以提供带电的图案化的水笼罩在由硼形成的侧壁间隔物中掺杂的非晶硅层。

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