METHOD OF FABRICATING HIGHLY CONDUCTIVE LOW-OHMIC CHIP RESISTOR HAVING ELECTRODES OF BASE METAL OR BASE-METAL ALLOY

摘要

A highly conductive low-ohmic chip resistor is fabricated. The chip resistor has an electrode of a base metal or a base-metal alloy. The electrode of the base metal or the base-metal alloy and a resistor layer are prepared through thick film printing with sintering at a low temperature in air. In this case, a thick film paste formed of an inexpensive low-reduction potential metal (such as aluminum (Al) or nickel (Ni)) is formed through screen printing and the sintering. Thereafter, a layer of the inexpensive low-reduction potential metal is used as a sacrificial layer to be immersed in a metal solution having a high reduction potential. In this case, wet chemical substitution reaction is processed to obtain a metal electrode having a high reduction potential. Alternatively, the sacrificial layer is immersed in a mixed solution of several different metals having the high reduction potential to process the wet chemical substitution reaction for obtaining a metal alloy mixed in different compositions. Accordingly, the present invention excludes traditional features of fabricating the electrode of the base metal or the base-metal alloy through heat treatment only under a high-temperature reducing atmosphere. The present invention significantly reduces a manufacturing cost of the electrode of the base metal or the base-metal alloy in a market. In addition, efficiency at a technology level is significantly improved by combining the thick film printing.