The present invention provides a UV / moisture dual cure organosilicon adhesive having 97-98 parts by weight of a polymer and 2-3 parts by weight of a photoinitiator. The UV / moisture double-cured organosilicon adhesive belongs to a single-component adhesive, which causes a curing reaction in the presence of ultraviolet rays, a moisture curing reaction at the same time, and a moisture curing crosslinking reaction in the absence of ultraviolet rays. The polymer includes a double bond, a polysiloxane that can be photo-cured, and an alkoxy group and an epoxy group which can be cured by moisture to improve adhesion to a substrate.
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