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A method for measuring thermal conductivity and figure-of-merit of thermoelectric materials

机译:一种热电材料导热系数和品质因数的测量方法

摘要

The present invention relates to a method for measuring thermal conductivity and a thermal conductivity index of thermoelectric semiconductors. More particularly, an objective of the present invention is to provide a method for correcting an error due to a heat loss and heat generated by a material itself in a conductor occurring in a conventional Haman′s method. The method for correcting an error can be easily applied to more accurately evaluate performance and physical properties of thermoelectric semiconductors at various temperatures, and accurate evaluation of the properties of thermoelectric semiconductors can be useful for designing thermoelectric elements.
机译:本发明涉及一种用于测量热电半导体的热导率和热导率指数的方法。更具体地,本发明的目的是提供一种用于校正由于在传统的哈曼方法中发生的热损耗和导体中的材料本身所产生的热量引起的误差的方法。校正误差的方法可以容易地应用于更准确地评估在各种温度下的热电半导体的性能和物理性质,并且对热电半导体的性质的准确评估对于设计热电元件可以是有用的。

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