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SMD Wire Wound Resistor for SMD type and Method for Manufacturing Same

机译:SMD型SMD绕线电阻器及其制造方法

摘要

The present invention relates to a winding resistor which is miniaturized while maintaining the high capacity of an existing lead-type winding resistor so as to be mounted on a PCB substrate in an SMD type, and has a simple manufacturing process, and to a manufacturing method thereof. According to the present invention, an inner cap is forcibly fitted and fixed to both ends of a ceramic rod, an outer cap is forcibly fitted and fixed to the inner cap, a start part and an end part are spot-welded to an exposed surface formed on an upper portion of the inner cap in a state that a resistance line is wound on the ceramic rod, and an external paint is applied over the entire area of the resistance line and the inner cap, wherein the circumference of the outer paint is formed to be lower than that of the outer cap, such that miniaturization of parts can be realized, and the external cap can be mounted on a PCB substrate in a closely adhering state in an SMD type without a separate lead line while maintaining the high capacity through winding of the resistance line.
机译:绕组电阻及其制造方法技术领域本发明涉及一种在保持现有的引线型绕组电阻的高容量的同时能够以SMD型安装在PCB基板上且小型化的绕组电阻及其制造方法。其。根据本发明,将内盖强行安装并固定在陶瓷棒的两端,将外盖强行安装并固定在内盖上,将开始部分和结束部分点焊到裸露的表面上。在电阻丝缠绕在陶瓷棒上的状态下,在内盖的上部上形成外涂层,并且在该电阻线和内盖的整个区域上涂覆外涂层,其中外涂层的圆周为形成为比外盖的高度低,从而可以实现部件的小型化,并且可以在保持高容量的同时以贴紧状态将外盖以SMD型以紧密粘附的状态安装在PCB基板上。通过电阻线的绕组。

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