METHOD FOR CUTTING CERAMIC USING CUTTING FILM WITH ENHANCED INFRARED RAY ABSORPTIVITY

摘要

The present invention relates to a method for cutting ceramic using a cutting film with an enhanced infrared ray absorptivity. In a conventional art, ceramic has a higher energy absorptivity for ultraviolet rays than infrared rays such that usage of the conventional art comprises: (a) usage of ultraviolet rays for cutting ceramic even at a relatively expensive cost; or (b) usage of increased power of infrared ways. In the present invention, the method for cutting ceramic is provided with the cutting film with an enhanced infrared ray absorptivity such that lower power of infrared rays can be used to cut ceramic at a low cost.;COPYRIGHT KIPO 2018