首页> 外国专利> METHOD OF CALCULATING AND EXPERIMENTAL ESTIMATION OF RADIATION RESISTANCE OF INTEGRATED CIRCUITS TO THE ACTION OF SEPARATE CHARGED PARTICLES BASED ON LOCAL LASER IRRADIATION

METHOD OF CALCULATING AND EXPERIMENTAL ESTIMATION OF RADIATION RESISTANCE OF INTEGRATED CIRCUITS TO THE ACTION OF SEPARATE CHARGED PARTICLES BASED ON LOCAL LASER IRRADIATION

机译:基于局部激光辐照的集成电路对带电粒子作用的抗辐射计算和实验估算方法

摘要

FIELD: electrical engineering.;SUBSTANCE: method relates to the field of studies of the radiation resistance of semiconductor electronics products, in particular integrated circuits, to the effects of ionizing radiation. Method for estimating the radiation resistance of integrated circuits to the effect of separate charged particles, based on local laser irradiation, includes scanning of the crystal chip by a laser beam with a diameter in the range from 30 to 100 mcm in the plane of the instrumental layer of the crystal, revealing the regions most sensitive to single radiation effects (SRE) in which the most sensitive nodes are determined and the dependence of the threshold energy of the SRE-generating laser radiation on the spot diameter is removed. Each of the dependencies obtained is approximated by a mathematical model, and the threshold energy of the laser radiation, reduced to the highly focused one, is determined from the model parameters. In the same sensing nodes, the ionization response under local irradiation in the circuit supply loop is recorded. Based on the analysis of the amplitude-time characteristics of the ionization response, the effective capacitance and resistance of the crystal of the circuit and the effective charge collection lengths for each sensitive region are determined from the calculated nomograms. Further, the coefficient of conversion of the energy of laser radiation into equivalent values of linear energy losses (LEL) for the threshold energy reduced to highly focused laser radiation is determined. Then, the IC chip is sequentially scanned with a laser beam with a fixed spot diameter value, increasing the energy of the laser radiation pulses from the SRE-generating threshold to the saturation energy; for each energy value, the effective value of the LEL and the corresponding SRE cross-section are determined, the dependence of the SRE cross-sections on the effective values of the LEL is built and the value of the saturation cross-section is determined.;EFFECT: technical result of the invention consists in carrying out the tests of integrated circuits, including those having multilayer metallization, for the radiation resistance of SRE to the action of high-energy separate charged particles without the use of calibration with the help of ion accelerators in estimating the equivalent linear energy losses.;1 cl, 7 dwg
机译:技术领域:方法涉及半导体电子产品,特别是集成电路的辐射电阻的研究领域,涉及电离辐射的影响。基于局部激光辐照来估计集成电路对单独的带电粒子的影响的辐射电阻的方法包括:通过在仪器平面中直径为30至100 mcm的激光束扫描晶体芯片晶体层,揭示了对单个辐射效应(SRE)最敏感的区域,在其中确定了最敏感的节点,并消除了产生SRE的激光辐射的阈值能量对光斑直径的依赖性。通过数学模型对获得的每个依赖关系进行近似,并从模型参数中确定降低到高度聚焦的激光辐射的阈值能量。在相同的传感节点中,记录电路供应回路中局部照射下的电离响应。基于对电离响应的幅度-时间特性的分析,可以从计算出的列线图确定每个敏感区域的电路晶体的有效电容和电阻以及有效电荷收集长度。此外,针对降低到高度聚焦的激光辐射的阈值能量,确定了激光辐射的能量转换成线性能量损失(LEL)的等效值的转换系数。然后,用具有固定光斑直径值的激光束顺序扫描IC芯片,从而将激光辐射脉冲的能量从生成SRE的阈值增加到饱和能量;对于每个能量值,确定LEL的有效值和相应的SRE横截面,建立SRE横截面对LEL的有效值的依赖性,并确定饱和横截面的值。效果:本发明的技术结果在于对集成电路进行测试,包括具有多层金属化的集成电路,以测试SRE对高能分离带电粒子的抗辐射能力,而无需借助离子进行校准加速器估算等效线性能量损失。; 1 cl,7 dwg

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