首页> 外国专利> Support plate with a module - and current supply management for a number of 2 to n modules in the smart mobility architecture format having different functions, which by means of a bus protocol on a common physical platform in addition to

Support plate with a module - and current supply management for a number of 2 to n modules in the smart mobility architecture format having different functions, which by means of a bus protocol on a common physical platform in addition to

机译:具有模块的支撑板-智能移动架构格式中的2到n个模块的电流供应管理具有不同的功能,这些功能还通过通用物理平台上的总线协议来实现

摘要

backplanes, in various standards and are defined with respect to the smallest detail. On the basis of this art is the backplane for modules built up in the smart mobility architecture format. The invention, however, relates to the use of just this module format. Already existing smart mobility architecture processor modules is to use has not previously been provided. It is produced through the use of the miniaturized computer modules a flexibly configurable computer concept which the high performance, the modular construction and the versatile usability of the known 19 "board level systems are combined.The small board level systems in the smart mobility architecture format are to be operated without active cooling and by the low mass can be used reliably even under difficult conditions.The present invention completes the previous development of the board level computer by a further miniaturization step. This is visible on the construction of the previous systems. A backplane carries the computer - and periphery cards, which with mezzanine cards supplementary functions. In the next step, the mezzanine card is inserted directly onto the backplane and thus the previous computer - and periphery cards eliminated. For additional functions are mounted on the other modules mezzanine card mounted.The result is realized in this invention in which the additional modules to be inserted directly on the carrier board and the higher integration of the components by the continuing miniaturization of the systems is used in a consequent.n="6"
机译:各种标准中的背板,并针对最小的细节进行定义。基于该技术的是以智能移动架构格式构建的模块的底板。然而,本发明仅涉及该模块格式的使用。先前尚未提供已经使用的现有智能移动架构处理器模块。它是通过使用微型计算机模块生产的,可灵活配置的计算机概念将已知的19英寸板级系统的高性能,模块化结构和通用性结合在一起。智能移动架构格式的小板级系统本发明通过进一步的小型化步骤完成了板级计算机的先前开发,这在先前系统的构造上是可见的。背板可承载计算机及外围卡,这些卡具有夹层卡的补充功能;下一步,将夹层卡直接插入背板,从而无需使用先前的计算机和外围卡;另外,还可以安装其他功能模块夹层卡安装。在本发明中实现了附加结果因此,将使用直接插入承载板上的最终模块,并通过系统的不断小型化来实现组件的更高集成度。n=“ 6”

著录项

  • 公开/公告号DE102016014158A1

    专利类型

  • 公开/公告日2018-05-30

    原文格式PDF

  • 申请/专利权人 FRIEDRICH FIX;

    申请/专利号DE20161014158

  • 发明设计人 GLEICH ANMELDER;

    申请日2016-11-26

  • 分类号G06F1/16;

  • 国家 DE

  • 入库时间 2022-08-21 12:34:51

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号