Double-sided adhesive tape, electronic instrument provided with double-sided adhesive tape, disassembly structure provided with double-sided adhesive tape and bonded structure

摘要

An adhesive technique is provided for delaminating a relevant material while meeting the requirements for the reliability assurance temperature for the material from a viewpoint of reproducing the material. A double-sided adhesive tape comprising: a pair of adhesive layers and an electroconductive heat generation layer disposed between the pair of adhesive layers, wherein at least one of the pair of adhesive layers contains a thermal foaming agent and the end surface of the electroconductive heat generation layer protrudes from the end surface of at least one of the adhesive layers.