Housing arrangement for a waste heat developing an electronic assembly, in particular a switched-mode power supply for data processing equipment

摘要

Housing arrangement for a waste heat developing an electronic assembly, in particular a switched-mode power supply for data processing devices, consisting of a base body with a substantially u - shaped cross section, which the housing floor (1) and the housing along the side surfaces (2; 3) forms, end-side locking surfaces (8) as well as a housing cover (11), further comprising located in the interior of the circuit carrier (15) for receiving an active and passive electronic components, together with the cooling bodies (4), wherein the components and / or the cooling body inside the housing are located in different areas and, in at least partially of different height, as well as with means for cooling, characterized in that, in order to direct thermal coupling of the heat sources to a plane which can be used in the housing cover area of the cooling plate (5) as a heat sink, heat-conducting coupling elements (6) are used which, on the one hand, heat transfer contact with the respective heat source and, on the other hand, while compensating for the respective difference in height to the underside of the flat cooling plate (5), and this is also thermally contacting, further the cooling plate (5) means for guiding a cooling means fluid, wherein the to - and outflow of the cooling fluid, preferably via a of the end fastening surfaces (8) takes place and in this respect, connection connectors (9; 10) are provided.