ARRANGEMENT FOR TESTING THE BEHAVIOR OF CHIPS WITH LASER ATTACKS THROUGH THE REAR FACING

摘要

The invention relates to a test assembly of a printed circuit chip, comprising a printed circuit board (10) provided with an orifice (12); and a coating material (22) adhered to a first face of the plate and holding the chip (18) at the orifice so as to expose the back face of the chip through the orifice.