QUALITY MANAGEMENT DEVICE AND METHOD FOR CONTROLLING QUALITY MANAGEMENT DEVICE

摘要

A quality management apparatus that manages a surface mounting line including a solder printing apparatus configured to print solder on a printed circuit board, a mounter configured to dispose an electronic component on the printed circuit board, a first inspection apparatus configured to inspect a solder printing state and an electronic component disposition state, a reflow furnace configured to perform solder bonding, and a second inspection apparatus configured to inspect a solder bonding state, the quality management apparatus includes: a defective factor estimator configured to extract, when the second inspection apparatus detects a defect, an inspection item that is estimated to be associated with the defect in inspection items inspected with the first inspection apparatus; a quality determination unit configured to acquire an inspection result corresponding to the extracted inspection item, and to determine whether the inspection result indicates an abnormality; and a parameter changer configured to decide a parameter to be changed and a content of the parameter in parameters used in the solder printing apparatus or the mounter when the inspection result indicates the abnormality.