ENCLOSURE STRUCTURE, DYNAMIC HEAT DISSIPATION METHOD FOR HEAT SOURCE IN ENCLOSURE STRUCTURE, AND DYNAMIC HEAT DISSIPATION SYSTEM

摘要

An enclosure and a dynamic heat dissipation method for a heat source inside the enclosure and a dynamic heat dissipation system inside the enclosure are provided. The dynamic heat dissipation method includes: acquiring a relatively low temperature area of the enclosure; and driving the heat source to move to the relatively low temperature area. In this solution, a heat source, which is at a relatively fixed position located inside the enclosure in a conventional sense, is artificially and actively transformed into a mobile heat source, so as to allow the heat source to be self-adapted to the temperature field; a relatively low temperature area inside the enclosure is searched, taking advantage of the characteristics of temperature differences existing in a field (a temperature field) of the structure (the enclosure), the position of the heat source is adjusted and the heat dissipation layout inside the enclosure is adjusted, thereby providing the heat source with an optimal direction (a direction of a temperature gradient) of heat transfer from the inside to the outside of the enclosure and an enclosure environment where the heat is dissipated at a maximum rate, that is, dissipating the heat dynamically. Therefore, the operating temperature of the mobile heat source is reduced, the service life of the mobile heat source is extended, and the reliability and safety of the system are improved.