首页> 外国专利> METHOD FOR PRODUCING NICKEL THIN FILM ON Si SUBSTRATE BY CHEMICAL VAPOR DEPOSITION METHOD, AND METHOD FOR PRODUCING Ni SILICIDE THIN FILM ON Si SUBSTRATE

METHOD FOR PRODUCING NICKEL THIN FILM ON Si SUBSTRATE BY CHEMICAL VAPOR DEPOSITION METHOD, AND METHOD FOR PRODUCING Ni SILICIDE THIN FILM ON Si SUBSTRATE

机译:化学气相沉积法在硅基体上制备镍薄膜的方法,以及在硅基体上制备硅化镍薄膜的方法

摘要

A method for producing a nickel thin film on a Si substrate by a chemical vapor deposition method, in which the nickel thin film is formed by use of a hydrocarbon-type nickel complex represented by a following formula as a raw material compound, which is a nickel complex in which a cyclopentadienyl group (Cp) or a derivative thereof and a chain or cyclic alkenyl group having 3 to 9 carbon atoms or a derivative thereof are coordinated to nickel and an element other than carbon and hydrogen is not contained in the structure, use of hydrogen as a reaction gas, and use of a film formation pressure of 1 to 150 torr and a film formation temperature of 80 to 250°C as film formation conditions (In the formula, X represents a chain or cyclic alkenyl group having 3 to 9 carbon atoms or a derivative thereof. R 1 to R 5 which are substituent groups of the cyclopentadienyl group represent C n H 2n+1 and n represents an integer of 0 to 6).
机译:一种通过化学气相沉积法在Si基板上制备镍薄膜的方法,其中,通过使用下式表示的烃型镍络合物作为原料化合物形成镍薄膜,所述镍化合物是其中环戊二烯基(Cp)或其衍生物和具有3至9个碳原子的链或环状烯基或其衍生物与镍配位并且结构中不包含除碳和氢以外的元素的镍配合物,作为反应条件,使用氢作为反应气体,使用1〜150torr的成膜压力,80〜250℃的成膜温度。(式中,X表示具有3至9个碳原子的链或环状烯基或其衍生物。作为环戊二烯基的取代基的R 1至R 5表示C n H 2n + 1,n表示整数0至6)。

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