SILVER ALLOY FILM, AND SPUTTERING TARGET FOR FORMING SILVER ALLOY FILM

摘要

PROBLEM TO BE SOLVED: To provide an Ag alloy film that is excellent in migration resistance and sulfur resistance and to provide a sputtering target for forming an Ag alloy film that achieves film formation of an Ag alloy film having stable in-plane characteristics even when forming the film on a large-area substrate.;SOLUTION: The Ag alloy film has a composition containing 0.1-1.5 mass% In (both inclusive), 1-50 mass ppm Cu (both inclusive) and the balance Ag with inevitable impurities. The sputtering target 10 for forming an Ag alloy film has an oxygen concentration of less than 50 mass ppm, has an area of sputtering surface 11 of 0.25 m² or more and has an in-plane concentration distribution of Cu: D_Cu=σ_Cu/μ_Cu×100 [%], defined by an average value μ_Cu of Cu concentration analysis value and a standard deviation σ_Cu of Cu concentration analysis value as determined by analyzing a Cu concentration at a plurality of places of the sputtering surface 11, of 40% or less.;COPYRIGHT: (C)2016,JPO&INPIT