ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE

摘要

A method for manufacturing electronic apparatus of the present invention includes: a step (A) of preparing a structure (100) provided with an adhesive film (50) and one or two or more electronic components (70) affixed to an adhesive surface of the adhesive film (50); a step (B) of disposing the structure (100) in the electronic component testing apparatus (200) such that the electronic component (70) is positioned over an electronic component installation region (85) of a sample stand (80) of the electronic component testing apparatus (200) with the adhesive film (50) interposed between the electronic component (70) and the electronic component installation region (85), the electronic component testing apparatus (200) being provided with the sample stand (80) including the electronic component installation region (85) and a probe card (90) that is provided at a position facing the sample stand (80) and includes a probe terminal (95); a step (C) of evaluating the properties of the electronic component (70) in a state of being affixed to the adhesive film (50) with the probe terminal (95) being in contact with a terminal (75) of the electronic component (70); and a step (D) of picking up the electronic component (70) from the adhesive film (50) after the step (C). In addition, at least in the step (C), the structure (100) is disposed within a frame (150), an end portion (55) of the adhesive film (50) is fixed to the frame (150), and an upper surface (155) of the frame (150) is disposed below an upper surface (88) of the electronic component installation region (85) of the sample stand (80) in a perpendicular direction X of the sample stand (80).