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COPPER REMOVAL ELECTROLYTIC TREATMENT METHOD, COPPER REMOVAL ELECTROLYTIC TREATMENT DEVICE

机译:去除铜的电解方法,去除铜的电解装置

摘要

To provide a method for preventing generation of problems such as short circuit or reduction of operation efficiency, due to abnormal growth of copper grains while maintaining high current efficiency.SOLUTION: There is provided a copper removal electrolytic treatment method in a process for manufacturing electric nickel from a copper-containing nickel chloride solution obtained by conducting a chlorine exudation treatment on nickel sulfide, the manufacturing process of electric nickel includes a cementation process having a process for a first process for adding the nickel sulfide to the copper-containing nickel chloride solution to reduce Cuto Cuin the copper-containing nickel chloride solution, and a second process for adding nickel mat and chlorine exudation residue to a resulting slurry to stabilizing Cuas a sulfide. In the copper removal electrolytic treatment, a reaction termination liquid obtained in the first process in the cementation process is supplied to an electrolytic tank having an anode constituted by a metal containing titanium, and having Ra of a surface where copper is deposited of 0.2 o 1.2 μm and Rz of 1.2 to 6.0 μm, and a cathode as an initiation liquid.SELECTED DRAWING: Figure 6
机译:本发明提供一种在维持高电流效率的同时防止由于铜晶粒的异常生长而引起的短路或工作效率降低等问题的产生方法。从通过对硫化镍进行氯渗出处理而获得的含铜氯化镍溶液中得到的镍,电镍的制造过程包括胶结过程,该步骤具有用于将硫化镍添加到含铜氯化镍溶液中的第一步骤的过程。在含铜的氯化镍溶液中还原Cuto Cu,然后进行第二步,将镍垫和氯的渗出残留物添加到生成的浆液中,以稳定硫化铜。在除铜电解处理中,将在固结处理的第一步骤中获得的反应终止液供给到电解槽中,该电解槽的阳极由含钛的金属构成,并且其沉积铜的表面的Ra为0.2 o 1.2 μm和Rz为1.2至6.0μm,并使用阴极作为引发液。图6

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