EPOXY RESIN COMPOSITION, THERMALLY CONDUCTIVE ADHESIVE, RESIN SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE, POWER SEMICONDUCTOR DEVICE AND LED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition that makes it possible to obtain a cured product with a low elastic modulus and a high thermal conductivity.;SOLUTION: An epoxy resin composition contains an epoxy resin having a mesogenic skeleton, a curing agent containing a phenol novolac resin having an allyl group directly bonded to a carbon atom of an aromatic ring, and a thermally conductive filler.;SELECTED DRAWING: None;COPYRIGHT: (C)2020,JPO&INPIT