GRINDING PROCESSING METHOD AND GRINDING PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve flatness of a substrate in grinding processing, by restraining the occurrence of a dimple caused by executing the grinding processing in a state of nipping foreign matter between the substrate and a vacuum suction part in the grinding processing.;SOLUTION: A grinding processing method is the grinding processing method for grinding-processing the other surface of a workpiece held by a vacuum suction part, by holding the workpiece by vacuum-sucking one surface of the plate-like workpiece by the vacuum suction part, and includes rubbing-together the one surface of the workpiece and the vacuum suction part before vacuum-sucking the one surface of the workpiece by the vacuum suction part.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT