首页> 外国专利> POSITION DETECTING DEVICE OF SEMICONDUCTOR WAFER AND POSITION DETECTING METHOD OF SEMICONDUCTOR WAFER, AND POSITIONING DEVICE OF SEMICONDUCTOR WAFER AND POSITIONING METHOD OF SEMICONDUCTOR WAFER

POSITION DETECTING DEVICE OF SEMICONDUCTOR WAFER AND POSITION DETECTING METHOD OF SEMICONDUCTOR WAFER, AND POSITIONING DEVICE OF SEMICONDUCTOR WAFER AND POSITIONING METHOD OF SEMICONDUCTOR WAFER

机译:半导体晶片的位置检测装置和半导体晶片的位置检测方法,以及半导体晶片的位置检测装置和半导体晶片的定位方法

摘要

PROBLEM TO BE SOLVED: To provide an art capable of detecting a position of a semiconductor wafer in which a modifying layer to make the semiconductor wafer be divided into a plurality of flaky substances when external force is applied is formed inside.;SOLUTION: A positioning device of a semiconductor wafer WF comprises: supporting means 20 for supporting a semiconductor wafer WF; a position detecting device 30 for detecting a position of the semiconductor wafer WF; and transferring means 40 for arranging the semiconductor wafer WF on a predetermined position based on the detection result of the position detecting device 30. The semiconductor wafer WF has a modifying layer AL inside to make the semiconductor wafer WF be divided into a plurality of flaky substances when external force is applied. The position detecting device 30 comprises: transmitting means 31 for transmitting sound waves to the semiconductor wafer WF; receiving means 32 for receiving sound waves transmitted to the semiconductor wafer WF by the transmitting means 31; and analyzing means 33 for detecting conditions of the modifying layer AL from the sound waves received by the receiving means 32 to detect a position of the semiconductor wafer WF from the detection result.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:提供一种能够检测半导体晶片的位置的技术,其中当在施加外力时形成用于使半导体晶片分为多种片状物质的改性层。半导体晶片WF的装置包括:用于支撑半导体晶片WF的支撑装置20;位置检测装置30,用于检测半导体晶片WF的位置。传送装置40,用于根据位置检测装置30的检测结果将半导体晶片WF排列在预定位置上。半导体晶片WF的内部具有改性层AL,以将半导体晶片WF分为多种片状物质。当施加外力时。位置检测装置30包括:传输装置31,用于将声波传输至半导体晶片WF;以及接收装置32,用于接收由发送装置31发送给半导体晶片WF的声波。分析装置33,用于从接收装置32接收的声波中检测出改性层AL的状态,并根据检测结果来检测半导体晶片WF的位置。图1,版权:(C)2019,日本特许厅

著录项

  • 公开/公告号JP2019075510A

    专利类型

  • 公开/公告日2019-05-16

    原文格式PDF

  • 申请/专利权人 LINTEC CORP;

    申请/专利号JP20170202156

  • 发明设计人 SUGISHITA YOSHIAKI;

    申请日2017-10-18

  • 分类号H01L21/301;

  • 国家 JP

  • 入库时间 2022-08-21 12:24:40

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