首页> 外国专利> ELECTRONIC COMPONENT PACKAGING BODY AND PEELING METHOD FOR ELECTRONIC COMPONENT PACKAGING BODY

ELECTRONIC COMPONENT PACKAGING BODY AND PEELING METHOD FOR ELECTRONIC COMPONENT PACKAGING BODY

机译:电子零件包装体及包装方法

摘要

To provide techniques capable of stably storing an electronic component and also smoothly peeling a cover tape.SOLUTION: There is provided an electronic component packaging body (1) which comprises a carrier tape (11) provided with a plurality of electronic component storage parts (12) in a length direction, and a cover tape (10) stuck on the carrier tape (11) to at least cover the electronic component storage parts (12). The carrier tape (11) comprises a first joint part (15) and a second joint part (16) provided outside both width-directional end parts of the plurality of electronic component storage parts (12) on the carrier tape (11) and in a longitudinal direction of the carrier tape (11), and one or both of the first joint part (15) and the second joint part (16) comprise inner curved parts provided ranging from outside the electronic component storage parts (12) to regions between the electronic component storage parts (12).SELECTED DRAWING: Figure 2
机译:为了提供能够稳定地存储电子部件并且还能够平滑地剥离覆盖带的技术。解决方案:提供一种电子部件包装体(1),其包括带有多个电子部件存储部(12)的载带(11)。 )在长度方向上),并在载带(11)上粘贴覆盖带(10),以至少覆盖电子元件存储部分(12)。载带(11)包括第一接合部(15)和第二接合部(16),该第一接合部(15)和第二接合部(16)设置在载带(11)上的多个电子零件收纳部(12)的宽度方向两端部的外侧和内侧。第一接合部(15)和第二接合部(16)中的一个或两者包括载带(11)的长度方向,并且从电子部件收纳部(12)的外侧到其间的区域具有内弯曲部。电子元件存储部件(12)。选定的图:图2

著录项

  • 公开/公告号JP2019172334A

    专利类型

  • 公开/公告日2019-10-10

    原文格式PDF

  • 申请/专利权人 TAIYO YUDEN CO LTD;

    申请/专利号JP20180063990

  • 发明设计人 SUGAI KAZUO;SATORI ATSUSHI;

    申请日2018-03-29

  • 分类号B65D85/86;B65D73/02;

  • 国家 JP

  • 入库时间 2022-08-21 12:23:34

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