ELECTROLESS NICKEL-PHOSPHORUS-COBALT PLATING BATH AND ELECTROLESS NICKEL-PHOSPHORUS-COBALT PLATING FILM

摘要

PROBLEM TO BE SOLVED: To provide an electroless nickel-phosphorus-cobalt plating bath capable of forming an electroless nickel-phosphorus-cobalt plating film having a high hardness and excellent in wear resistance and appearance without causing the instability of the plating bath.;SOLUTION: The electroless nickel-phosphorus-cobalt plating bath comprises: water-soluble nickel sa hypophosphite; a cobalt containing compound; a heavy metal compound; and at least one kind selected from a group consisting of an acetylene compound, an iodide or iodate ion source and a nitro group containing aromatic compound including one or more nitro groups. The concentration of the acetylene compound is 10-120 mg/L; the concentration of the iodide or iodate ion source is 10-4000 mg/L; and the concentration of the nitro group containing aromatic compound is 0.1-5000 mg/L.;SELECTED DRAWING: None;COPYRIGHT: (C)2019,JPO&INPIT