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3D multi-aperture imaging device, multi-aperture imaging device, method for providing output signal of 3D multi-aperture imaging device, and method for capturing the entire field of view
3D multi-aperture imaging device, multi-aperture imaging device, method for providing output signal of 3D multi-aperture imaging device, and method for capturing the entire field of view
A 3D multi-aperture imaging device and a method for providing an output signal of a 3D multi-aperture imaging device that enables processing of images captured with high functional bandwidth. The 3D multi-aperture imaging device described herein includes an image sensor (12) having a plurality of image sensor areas. Each image sensor area includes a plurality of pixels. The 3D multi-aperture imaging device has a first partial field of view (3011, 3012, 3013, 3014) that overlaps the entire field of view (28) in the first image sensor area (1211, 1212, 1213, 1214) of the image sensor. ) In the second image sensor area (1221, 1222, 1223, 1224) of the image sensor, and the first plurality (141) of optical channels (1611, 1612, 1613, 1614) A second plurality (142) of optical channels (1621, 1622,...) For projecting a second partial field (3021, 3022, 3023, 3024) of the entire field (28) overlapping the first partial field. 1623, 1624). The first and second optical channels are arranged laterally offset from each other by a basic distance (BA). The 3D multi-aperture imaging device is configured to receive image sensor data from the image sensor including information about the first and second partial fields projected onto the first and second image sensor areas, and the data A processor configured to provide an output signal including header and payload data. The data header includes information regarding the structure of the 3D multi-aperture imaging device, and the payload data includes image information acquired from the pixels of the first image sensor area and the second image sensor area. [Selection] Figure 1b
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