Backplane structure and process for microdrivers and micro LEDs

摘要

The integration scheme of micro LED and micro driver chip is described. In one embodiment, the microdriver chip includes a plurality of trenches formed in the bottom of the microdriver chip, each trench surrounding a conductive stud extending below the bottom of the microdriver chip body. An integration scheme for providing electrical connection to conductive terminal contacts and micro LEDs bonded to the display substrate and adjacent to the microdriver chip is further described.