首页> 外国专利> Polysilsesquioxane resin composition for flexible substrates {POLY SILSEQUINOXANE RESIN COMPOSION FOR FLEXIBLE SUBSTRATE}

Polysilsesquioxane resin composition for flexible substrates {POLY SILSEQUINOXANE RESIN COMPOSION FOR FLEXIBLE SUBSTRATE}

机译:用于挠性基材的聚倍半硅氧烷树脂组合物{挠性基材的聚硅氧烷二氧杂戊烷树脂组合物}

摘要

The present invention relates to a polysilsesquioxane resin composition for flexible substrates. More specifically, the present invention relates to a resin composition that can be used for a flexible display substrate, and relates to a polysilsesquioxane resin composition for a flexible substrate having excellent heat resistance and transparency. More specifically, a transparent thin film can be formed, exhibits excellent transparency in the visible light region even after curing, has excellent heat resistance, and can adjust flexibility and crack resistance characteristics. Insulation characteristics and passivation characteristics superior to those of existing polyimide substrate materials can be satisfied at the same time. In addition, it is advantageous in productivity by securing the release characteristics during the process of delamination from the glass substrate. [Selection] Figure 1
机译:本发明涉及一种用于挠性基材的聚倍半硅氧烷树脂组合物。更具体地,本发明涉及可以用于柔性显示基板的树脂组合物,并且涉及具有优异的耐热性和透明性的用于柔性基板的聚倍半硅氧烷树脂组合物。更具体地,可以形成透明薄膜,即使在固化之后,该透明薄膜在可见光区域中也表现出优异的透明性,具有优异的耐热性,并且可以调节挠性和抗裂性。可以同时满足优于现有聚酰亚胺衬底材料的绝缘特性和钝化特性。另外,通过确保在从玻璃基板剥离的过程中的释放特性,在生产率上是有利的。 [选择]图1

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