While the component C (solder S) is moved with respect to the recognition camera 5, the recognition camera 5 forms an image of light from the imaging ranges Rb and Rc on the imaging element 51 by the lens 52, whereby each of the imaging ranges Rb and Rc. A one-dimensional image of the part C (solder S) is picked up repeatedly. Moreover, since the lens 52 of the recognition camera 5 has non-telecentricity on the object side, three-dimensional information of the component C (solder S) can be obtained based on these two-dimensional images. In this way, two images viewed from different angles can be captured by the single recognition camera 5, and the three-dimensional information of the component C (solder S) can be obtained. As a result, it is possible to easily acquire highly accurate three-dimensional information of the component C (solder S) while suppressing an increase in cost.
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