Epoxy resin composition, curable resin composition, active ester, cured product, semiconductor sealing material, semiconductor device, prepreg, flexible wiring substrate, circuit substrate, build up film, build up substrate, fiber reinforced composite material, molded article

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition, a curable resin composition, and an active ester that allow a resultant cured product to express excellent flexibility, moisture absorption resistance, adhesion and color fastness, and further provide a semiconductor sealing material, a semiconductor device, a prepreg, a flexible wiring board, a circuit board, a build-up film, a build-up substrate, a fiber-reinforced composite material, and a molding each of which is prepared with the epoxy resin composition.SOLUTION: An epoxy resin composition according to the present invention comprises an active ester compound (P) represented by general formula (1), and an epoxy resin (Q).SELECTED DRAWING: None