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Silica sol and silica sol production method, silica powder production method, silica-containing epoxy resin composition production method, and silica-containing epoxy resin cured product production method
Silica sol and silica sol production method, silica powder production method, silica-containing epoxy resin composition production method, and silica-containing epoxy resin cured product production method
A silica sol having a silica particle size/average primary particle size ratio measured by dynamic light scattering of 3.0 or lower, the silica sol containing silica particles having an average primary particle size of 20-100 nm surface modified by an organic silane compound having ±-ray emission of 0.005 count/cm 2 ·hr or less and a coefficient of moisture absorption of 0.5 mass% or less when allowed to stand for 48 hours in a 23°C, 50% relative humidity (RH) environment.
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机译:通过动态光散射测得的二氧化硅粒径/平均一次粒径之比为3.0以下的二氧化硅溶胶,其平均粒径为20〜100nm的二氧化硅粒子被表面有机硅化合物改性后的平均一次粒径为20〜100nm。当在23℃,50%相对湿度(RH)的环境中放置48小时时,射线发射量为0.005count / cm 2·hr或更小,吸湿系数为0.5质量%或更小。
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