The present invention aims to provide a solder plating copper wire manufacturing method and device which can guarantee the adhesiveness of a copper wire and a solder plating layer, can reduce 0.2% yield strength and can manufacture the solder plating copper wire with a high production efficiency. In order to achieve the purpose, the solder plating copper wire manufacturing method is characterized by having the solder plating layer on the surface of the copper wire, and comprising the steps of utilizing the resistance heating or induction heating realized by electrification to dip the copper wire before being dipped in a molten solder bath and of which the temperature is heated to 650 DEG C and 1020 DEG C in the molten solder bath of which hte temperature is 230 DEG C and 330 DEG C for 0.7 to 4.0 seconds, then by a solder plating process of lifting up from the molten solder bath, the temperature of the molten solder bath of a temperature adjusting area nearby the copper wire in the molten solder bath is 230 DEG C and 440 DEG C.
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