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Phenol resin, epoxy resin composition, cured product using the same, copper-clad laminate, semiconductor sealing material
Phenol resin, epoxy resin composition, cured product using the same, copper-clad laminate, semiconductor sealing material
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机译:酚醛树脂,环氧树脂组合物,使用其的固化物,覆铜层压板,半导体密封材料
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摘要
The present invention addresses the problem of providing a novel phenolic resin that, when used as an epoxy resin curing agent, gives a cured product that exhibits excellent characteristics such as thermal resistance, moisture resistance, permittivity, and dielectric dissipation. The present invention additionally address the problem of providing: an epoxy resin composition containing the novel phenolic resin and an epoxy resin; a cured product of the epoxy resin composition; a copper-clad laminate in which the epoxy resin composition is used as a matrix resin; and a semiconductor sealing material that uses the epoxy resin composition. Provided are a phenolic resin that is represented by formula (1), an epoxy resin composition, and a cured product, a copper-clad laminate, and a semiconductor sealing material that use the epoxy resin composition.
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