Surface treatment plating material, connector terminal, connector, FFC terminal, FFC, FPC and electronic components

摘要

Provided is a surface-treated plated material in which the generation of whiskers is suppressed, good solderability and low contact resistance are maintained even when exposed to a high temperature environment, and the terminal / connector insertion force is low. An upper layer is provided on the base material, the upper layer includes a plating material containing Sn or In, and includes a compound represented by a predetermined general formula on the surface of the plating material, and a compound represented by a predetermined general formula, Furthermore, the surface treatment plating material which made 1 type or 2 types or more selected from the D structural compound group represented by a predetermined general formula adhere to the surface of the upper layer side.