首页> 外国专利> Composite substrate including first substrate having first surface, second substrate having second surface facing first surface, and first and second bumps provided at first surface

Composite substrate including first substrate having first surface, second substrate having second surface facing first surface, and first and second bumps provided at first surface

机译:复合衬底,包括具有第一表面的第一衬底,具有面对第一表面的第二表面的第二衬底以及设置在第一表面的第一凸块和第二凸块

摘要

A composite substrate includes: a first substrate; a second substrate; an electric contact; a first bump; and a second bump. The first substrate has a first surface. The first substrate has a thickness defining a thickness direction. The second substrate has a second surface. The second surface faces the first surface with a predetermined gap therebetween in the thickness direction. The electric contact is positioned at the second surface. The first bump includes: a core; and a conducting film. The core is provided at the first surface and has a convex shape protruding in the thickness direction. The conducting film covers a part of the core and is in contact with the electric contact. The second bump is provided at the first surface and has a convex shape protruding in the thickness direction. The second bump has a dimension in the thickness direction smaller than that of the first bump.
机译:一种复合基板,包括:第一基板;以及第二基板。第二基板;电触点;第一次碰撞和第二个碰撞。第一基板具有第一表面。第一基板具有限定厚度方向的厚度。第二基板具有第二表面。第二表面在厚度方向上与第一表面之间具有预定间隙。电触点位于第二表面。第一凸起包括:核心;和导电膜。芯设置在第一表面上,并且具有在厚度方向上突出的凸形。导电膜覆盖芯的一部分并且与电触点接触。第二凸块设置在第一表面上并且具有在厚度方向上突出的凸形。第二凸块在厚度方向上的尺寸小于第一凸块的尺寸。

著录项

  • 公开/公告号US10414160B2

    专利类型

  • 公开/公告日2019-09-17

    原文格式PDF

  • 申请/专利权人 BROTHER KOGYO KABUSHIKI KAISHA;

    申请/专利号US201815988381

  • 发明设计人 KEITA HIRAI;

    申请日2018-05-24

  • 分类号B41J2/14;

  • 国家 US

  • 入库时间 2022-08-21 12:17:04

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