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Optically isolated photodiode for high sensitivity application

机译:光电隔离光电二极管,用于高灵敏度应用

摘要

An integrated silicon-based photo-detection system, fabricated in an integrated silicon based structure on a silicon-on-insulator (SOI) wafer, includes a photodiode fabricated on an isolated area surrounded by a light barrier, where the light barrier is an area where the SOI wafer is removed, an optical waveguide that guides an input signal light into the photodiode, and external electrical traces that the free electron carriers flow into as photocurrent. A method of fabricating an integrated silicon-based photo-detection system in an integrated silicon based structure on a silicon-on-insulator (SOI) wafer, includes performing deep etching to create a light barrier surrounding an isolated area on the SOI wafer, fabricating a photodiode in the isolated area surrounded by the light barrier, fabricating an optical waveguide that guides an input signal light into the photodiode, and wirebonding external electrical traces to connect to the remainder of the integrated silicon based structure.
机译:在绝缘体上硅(SOI)晶片上以集成硅基结构制造的集成硅基光电检测系统,包括在被光栅包围的隔离区域上制造的光电二极管,其中光栅是一个区域在除去SOI晶片的地方,将输入信号光引导到光电二极管中的光波导以及自由电子载流子作为光电流流入的外部电迹线。一种在绝缘体上硅(SOI)晶片上以集成的硅基结构制造集成的基于硅的光检测系统的方法,包括执行深蚀刻以在SOI晶片上的隔离区域周围形成挡光层,光电二极管在被光障包围的隔离区域中,制造将输入信号光引导到光电二极管中的光波导,并将外部电气走线进行引线键合以连接到集成的硅基结构的其余部分。

著录项

  • 公开/公告号US10444445B2

    专利类型

  • 公开/公告日2019-10-15

    原文格式PDF

  • 申请/专利权人 CIENA CORPORATION;

    申请/专利号US201715430126

  • 发明设计人 FRANCOIS PELLETIER;

    申请日2017-02-10

  • 分类号G02B6/42;H01L27/142;G02B6/12;

  • 国家 US

  • 入库时间 2022-08-21 12:16:47

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