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INTERFACIAL LAYER FOR HIGH RESOLUTION LITHOGRAPHY (HRL) AND HIGH SPEED INPUT/OUTPUT (IO OR I/O) ARCHITECTURES
INTERFACIAL LAYER FOR HIGH RESOLUTION LITHOGRAPHY (HRL) AND HIGH SPEED INPUT/OUTPUT (IO OR I/O) ARCHITECTURES
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机译:高分辨率光刻(HRL)和高速输入/输出(IO或I / O)体系结构的界面层
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摘要
Embodiments described herein are directed to interfacial layers and techniques of forming such interfacial layers. An interfacial layer having one or more light absorbing molecules is on a metal layer. The light absorbing molecule(s) may comprise a moiety exhibiting light absorbing properties. The interfacial layer can assist with improving adhesion of a resist layer to the metal layer and with improving use of one or more lithography techniques to fabricate interconnects and/or features using the resist and metal layers for a package substrate, a semiconductor package, or a PCB. For one embodiment, the interfacial layer includes, but is not limited to, an organic interfacial layer. Examples of organic interfacial layers include, but are not limited to, self-assembled monolayers (SAMs), constructs and/or variations of SAMs, organic adhesion promotor moieties, and non-adhesion promoter moieties.
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