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Cu—Ni—Si-based copper alloy sheet having excellent mold abrasion resistance and shear workability and method for manufacturing same
Cu—Ni—Si-based copper alloy sheet having excellent mold abrasion resistance and shear workability and method for manufacturing same
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机译:具有优异的模具耐磨性和剪切加工性的Cu-Ni-Si基铜合金板及其制造方法
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摘要
A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.
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机译:本发明的Cu-Ni-Si类铜合金薄板在保持强度和导电性的同时,具有优异的耐模具磨损性和剪切加工性,其中,Ni的含量为1.0〜4.0质量%,Ni的含量为0.2〜0.9质量%。包含Si,其余部分由Cu和不可避免的杂质组成。在从表面起占整个片材厚度的20%的厚度的表面层中,具有在20nm至80nm范围内的粒径的Ni-Si沉淀颗粒的数量由颗粒/ mm <Sup表示。 > 2 Sup>,并且在表面层以下的部分中具有在20nm至80nm范围内的粒径的Ni-Si沉淀颗粒的数量由b颗粒/ mm 2 表示。 Sup>,a / b在0.5至1.5的范围内。
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