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SEMICONDUCTOR PACKAGES INCLUDING INDICATORS FOR EVALUATING A DISTANCE AND METHODS OF CALCULATING THE DISTANCE
SEMICONDUCTOR PACKAGES INCLUDING INDICATORS FOR EVALUATING A DISTANCE AND METHODS OF CALCULATING THE DISTANCE
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机译:包含用于评估距离的指标的半导体封装和计算距离的方法
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摘要
A semiconductor package may include a package substrate to which a first semiconductor chip is attached, an encapsulant covering the first semiconductor chip, and an indicator disposed within the semiconductor package. A side surface of the indicator is exposed at a side surface of the semiconductor package, and a width of a vertical section of the indicator parallel with the exposed side surface of the indicator varies as the vertical section of the indicator becomes farther from the side surface of the semiconductor package.
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