resins for use as bonding layers in multilayer films and multilayer films comprising the same

摘要

The present disclosure provides resins which may be used as a bonding layer in a multilayer structure and in multilayer structures comprising one or more bonding layers formed from such resins. in one aspect, a resin for use as a bonding layer in a multilayer structure comprises a first composition, wherein the first composition comprises at least one ethylene-based polymer and wherein the first composition comprises an mwcdi value greater than 0, 9 and a melt index ratio (i10 / i2) that satisfies the following equation: i10 / i2 = 7.0 - 1.2 x log (i2), wherein the first composition comprises 1 to 99 weight percent of resin; and a maleic anhydride grafted polyethylene comprising a maleic anhydride grafted high density polyethylene, a maleic anhydride grafted linear low density polyethylene, a maleic anhydride grafted polyethylene elastomer or a combination thereof, wherein the polyethylene is grafted with Maleic anhydride comprises from 1 to 99 weight percent of the resin.