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diamond tool cutting segment and diamond tool with segment

机译:金刚石刀具切割段和带有该段的金刚石刀具

摘要

The present invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle work such as stone, bricks, concrete and asphalt, and a diamond tool provided therewith. The invention allows for higher cutting speed and extended service life without suffering r wear during the cutting action. In the cutting segment, a number of diamond particles are distributed in a plurality of platiform layers stacked perpendicular to a cutting direction. each of the diamond particle layers has a plurality of particle rows on a cutting surface. moreover, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment viewed from the front of the cutting segment in the cutting direction. The invention ensures uniform cutting action by significantly reducing wear and tear during the cutting action and thus allows for higher cutting speed and longer service life.
机译:本发明涉及一种用于切割或钻孔诸如石材,砖,混凝土和沥青的脆性工件的金刚石工具的切割段,以及具有该切割段的金刚石工具。本发明允许更高的切割速度和延长的使用寿命,而在切割过程中不会遭受磨损。在切割段中,许多金刚石颗粒分布在垂直于切割方向堆叠的多个平台状层中。每个金刚石颗粒层在切割表面上具有多个颗粒行。此外,从切割部分的沿切割方向的正面看,至少两个金刚石颗粒层叠置在切割部分的至少一侧上。本发明通过显着减少切割动作期间的磨损来确保均匀的切割动作,从而允许更高的切割速度和更长的使用寿命。

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