A busduct joint assembly comprising a stack of electrically insulating separator plates (22), a respective busbar receiving gap between defined between each pair of separator plates for receiving respective busbar ends (6) of adjacent busduct sections therein to be in electrical contact with at least one connector plate (24) located therein, upper and lower cover plates (26, 28) being located on either side of the stack of separator plates, a fastener (32) extending between said cover plates and through mutually aligned apertures formed therein in order to clamp the separator plates and connector plates between the cover plates, a side cover (50) being provided on at least one side of the separator plates and having at least one heat exchange rib (52) extending into the stack of separator plates, wherein said at least one heat exchange rib extends between adjacent pairs of separator plates, on an opposite side of the separator plates from the associated busbar receiving gap.
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