METHOD FOR REMOVING POLLUTANTS CAUSED BY SPUTTERING AFFECTING INDIVIDUALIZED MICROCIRCUITS.

摘要

The present invention discloses a method for removing contaminants in microcircuits individualized from the process of metallization or sputtering of titanium-copper-titanium layers. Said method consists of the application of vibration for eliminating any contaminant and/or filament in the microcircuits. The vibration process includes pneumatic vibrators responsible for transferring vibratory waves to a tank where the microcircuits are located and include springs system allowing the vibration of the tray. The present invention is further applicable for any size of microcircuits in the same tray.