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Structural repair integrity evaluation

机译:结构修复完整性评估

摘要

A method for evaluating the integrity of a structural repair on a structural surface (110), comprising the following steps, taken in order: securing a patch (120) above a defect (112) on an underlying structural surface to form the repair; verify the integrity of a joint between the patch and the underlying structural surface; apply a deformation indicator (130) to the patch; obtaining, in a deformation measuring device (150), a first deformation measurement from the deformation indicator (130), said deformation measuring device being a handheld device, such as an electronic handheld device, a telephone mobile or a digital personal assistant; apply at least one stress test to the structural repair (120); obtaining, in the deformation measuring device (150), a second strain measurement from the deformation indicator (130) after the at least one stress test has been completed when the underlying structural surface is not subjected to an effort external; and generating, in the deformation measuring device (150), a signal when a difference between the first strain measurement and the second strain measurement exceeds a threshold.
机译:一种用于评估结构表面(110)上的结构修复的完整性的方法,该方法包括以下步骤:依次将补丁(120)固定在基础结构表面上的缺陷(112)上方以形成修复;验证修补程序与基础结构表面之间的接合处的完整性;将变形指示器(130)施加到补片上;在变形测量设备(150)中,从变形指示器(130)获得第一变形测量,所述变形测量设备是手持设备,例如电子手持设备,电话机或数字个人助理。对结构修复进行至少一项压力测试(120);当下面的结构表面不受外力作用时,在至少一个应力测试完成之后,在变形测量装置(150)中从变形指示器(130)获得第二应变测量;当第一应变测量值与第二应变测量值之差超过阈值时,在变形测量设备(150)中生成信号。

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