SINGLE-COMPONENT THERMOSETTING EPOXY RESIN HAVING HIGH SCOURING RESISTANCE

摘要

The invention relates to single-component thermosetting epoxy resin adhesives, comprising: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt% aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25 °C, wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 µm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25 °C). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40 °C to 70 °C and are scouring-resistant, even at higher temperatures.