首页> 外国专利> RESIN COMPOSITION, PRODUCTION METHOD THEREOF, MOLDED BODY, MULTILAYER STRUCTURE, FILM, PRODUCTION METHOD THEREOF, VAPOR DEPOSITION FILM, PACKAGING MATERIAL, VACUUM PACKAGING BAG, VACUUM INSULATION BODY, THERMOFORMED CONTAINER, BLOW MOLDED CONTAINER, FUEL CONTAINER, AND BOTTLE CONTAINER

RESIN COMPOSITION, PRODUCTION METHOD THEREOF, MOLDED BODY, MULTILAYER STRUCTURE, FILM, PRODUCTION METHOD THEREOF, VAPOR DEPOSITION FILM, PACKAGING MATERIAL, VACUUM PACKAGING BAG, VACUUM INSULATION BODY, THERMOFORMED CONTAINER, BLOW MOLDED CONTAINER, FUEL CONTAINER, AND BOTTLE CONTAINER

机译:树脂组成,其制造方法,成型体,多层结构,膜,其制造方法,气相沉积膜,包装材料,真空包装袋,真空绝缘体,热容容器,容器,内胆,模壳

摘要

A resin composition is provided which, even when the film forming temperature is set high, can suppress excessive increases in torque while suppressing neck-in during film production, which can form, continuously over a long period of time, molded bodies with excellent appearance in which defects such as fish eye and streaks are suppressed, and which can produce, continuously over a long period of time, multilayer structures which can be thermoformed into thermoformed bodies with excellent appearance; a production method of said resin composition, and a molded body and a multilayer structure containing said resin composition are also provided. This resin composition contains (A) an ethylene-vinyl alcohol copolymer with an ethylene unit content of 20-60 mol%, and a boron compound (B), wherein the boron compound (B) contains free boric acid (C), and, in terms of orthoboric acid, the content of the boron compound (B) relative to the ethylene-vinyl alcohol copolymer (A) is 100-5000 ppm, and the ratio of free boric acid (C) in the boron compound (B) in terms of orthoboric acid is 0.1-10 mass%.
机译:本发明提供一种树脂组合物,其即使将成膜温度设定得较高,也能够抑制扭矩的过度上升并抑制成膜时的颈缩,并且能够长时间连续地形成外观优异的成型体。哪些缺陷可以被抑制,例如鱼眼和条纹,并且可以长时间连续产生多层结构,该多层结构可以被热成型为具有优良外观的热成型体;还提供了所述树脂组合物的制造方法,以及包含所述树脂组合物的成型体和多层结构。该树脂组合物含有(A)乙烯单元含量为20〜60摩尔%的乙烯-乙烯醇共聚物和硼化合物(B),其中,硼化合物(B)含有游离硼酸(C),以及,就原硼酸而言,硼化合物(B)相对于乙烯-乙烯醇共聚物(A)的含量为100-5000ppm,且硼化合物(B)中游离硼酸(C)的比例为原硼酸的含量为0.1-10质量%。

著录项

  • 公开/公告号WO2019131844A1

    专利类型

  • 公开/公告日2019-07-04

    原文格式PDF

  • 申请/专利权人 KURARAY CO. LTD.;

    申请/专利号WO2018JP48062

  • 申请日2018-12-27

  • 分类号C08L29/04;B32B27/08;B32B27/28;B65D65/40;C08J5/18;C08K3/38;

  • 国家 WO

  • 入库时间 2022-08-21 11:54:04

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