COPPER-BASED MICROCRYSTALLINE ALLOY, PREPARATION METHOD THEREOF, AND ELECTRONIC PRODUCT

摘要

The present invention relates to a copper-based microcrystalline alloy, a preparation method thereof, and an electronic product. The copper-based microcrystalline alloy comprises, in weight percent, 30-60% of Cu, 25-40% of Mn, 4-6% of Al, 10-17 of Ni, 0.01-10% of Si, and 0.001-0.03% of Be, based on the total amount of the copper-based microcrystalline alloy.