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EVENT-BASED VISION SENSOR MANUFACTURED WITH 3D-IC TECHNOLOGY
EVENT-BASED VISION SENSOR MANUFACTURED WITH 3D-IC TECHNOLOGY
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机译:采用3D-IC技术制造的基于事件的视觉传感器
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摘要
An event-based vision sensor is fabricated using an advanced stacking technique, known as Three-Dimensional Integrated Circuit, which stacks more wafers (or dies) and interconnects them vertically. The electronic integrated circuits of the sensor are then distributed between the two or more electrically connected dies.
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