SOLDER PASTE PRINTING METHOD, SOLDER PASTE PRINTING MASK, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT MODULE

摘要

The present invention comprises: a preparation step for preparing a printed wiring board that has a resist layer formed on a metal pattern layer; a mask disposition step for abutting, against the printed wiring board, a recess/projection solder paste printing mask in which an opening is formed corresponding to an exposed surface region of the metal pattern layer, and the edge of the opening projects; and a squeegeeing step for transferring the solder paste onto the surface region of the metal pattern layer via the opening, wherein the solder paste printing mask is positioned such that the projection part of the solder paste printing mask comes into contact with the edge of the resist layer and the recess part of the solder paste printing mask comes into contact with the center of the resist layer.