AUTONOMOUS DEVICE FOR ADVANCED IMAGE ANALYSIS, INTELLIGENT IMAGE RECOGNITION AND IMAGE EVALUATION

摘要

An autonomous device for image recognition comprising a housing in which a camera block (1) with an image sensor (11) and a process block (2) with at least one process unit (12) are stored, where both of these blocks (1,2) are separated from each other by means of a thermal insulation partition (3), wherein the camera block (1) and the process block (2) are signal-connected by a connecting element (20) and electrically powered, where the camera block (1) has a camera block (1) housing (6) formed by a base (61 ) provided with ribbing (24) and a cover (8) with an aperture (10) provided with a lens (17) of a camera module (16) with an image sensor (11) which is covered by a lens cover (46) with a lens slit (47), where the lens cover (46) is attached to the camera block base (61) by means of lens cover fastening screws (48), and the process block (2) has a process block (2) housing (7) formed by a base (71) provided with ribbing (24) and a cover (9) and a mounting cap (27), wherein between the housing (6) of the camera block (1) and the housing (7) of the process block (2), a thermal insulation partition (3) provided with an aperture (4) and a pair of thermal insulation inserts (50) is arranged, forming a channel (4b) through which a connecting element (20), that is formed by a cable (37), passes and which connects the printed circuit board (5) to the first heat pump (321 ) through the printed circuit board connector (39) and to the camera module (16) through the camera module connector (23), wherein a process unit (12) is disposed on the printed circuit board (5) located in the process block (2), and the printed circuit board (5) is further connected using a flexible portion (21) with a fixed expansion portion (22) of the printed circuit board on which a high speed connector (49) is arranged, wherein the printed circuit board (5) is further connected through a first stacking connector (331) and a second stacking connector (332) to the I/O plate (34) which is connected through an I/O connector (35) using the flexible portion (21) of the printed circuit board to the I/O connector plate (36) to which a GPIO connector (18) is connected, where the I/O plate (34) is connected to the supply printed circuit board (31) through a second stacking connector (332) and a third stacking connector (333), which supply printed circuit board is further connected by the cable (37) through a supply connector (38) to a power connector (19), and where a second heat pump (322) is arranged between the process block (2) housing (7) and the printed circuit board (5), and a third heat pump (323) is arranged between the process block (2) housing (7) and the supply printed circuit board (31).